Advanced PV wafer laser processing tool at PVSEC 2009

M-Solv will exhibit the Advanced PV Laser Process production tool MSV W1 at the 24th PVSEC (21st to 24th September 2009) which will be held at the CCH - Congress Center and International Fair in Hamburg, Germany.

Please visit us on our Booth which is in hall B4. no 12

The MSV W1 has been designed as a configurable laser process manufacturing tool for mono and multi crystalline photovoltaic wafers.  This innovative system can be equipped with a wide variety of Solid State laser sources suitable for direct write micromachining and thin film structuring for Solar applications.

Design for Production

Laser beams are manipulated by a Galvanometer scanner at high speed to enable highest laser processing rate even with intricate and high resolution patterns or features.

The rotary process platform employs a number of processing stations.  Wafers are automatically and continuously loaded onto the platform which sequentially moves each wafer to a different station, loading, aligning, processing, checking, and unloading.

Advanced High Efficiency Wafer Processing

The MSV W1 is designed specifically for new advanced processes employed to increase the conversion efficiency of crystalline solar cells, such as:

• LGBC - Laser Grooved Buried Contacts forming emitter contacts
• LFC    - Laser fired Contacts rear.
• Laser doping and annealing
• Wrap through technologies EWT and MWT

To witness the technology please visit us at the Exhibition.