MSV101 - Laser Micromachining and Inkjet for R&D and Wafer processes 
The MSV-101 Laser Micromachining and inkjet deposition tool for R&D and wafer processes
The MSV-101 is a high accuracy and resolution hybrid ablative laser micromachining and ink jet deposition tool principally designed for R&D, general microstructuring and prototyping for a wide variety of industrial production and development applications. The MSV 101 utilises a modular platform to which a wide range of lasers, industrial ink jet heads, optical and fluid delivery systems and process diagnostics can be specified according to the required purpose or application.
The MSV-101 represents a cost effective solution to process development in microelectronics, thin film or Transparent Conducting oxide patterning and removal such as ITO. Photovoltaic crystalline cell scribing, drilling, cutting and patterning is also a popular application for this adaptable machinery.
- Specification
- Class 1 laser safe enclosure
- Stable granite construction
- Various DPSS Lasers available: 1024nm, 512nm, 355nm
- 300mm x 300mm travel X-Y stages
- 6” X 6” Vacuum Chuck
- High speed scanner with 160mm field
- 1050mm x 1700mm overall footprint
- Roll to Roll handling optional
Process
- UV Laser photoablation of material
- Ink Jet of conductive and insulating layers
- Single step, environmentally friendly, dry process
- Rapid and flexible change of circuit design
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