MSV208 - High throughput production for thin film patterning and removal MSV208 - High throughput production for thin film patterning and removal
The MSV208 is a high-specification tool for step-and-scan thin film ablation or other processing on both sides of a planar substrate. This approach optimizes processing speed while minimizing footprint. Originally aimed at touch-screen applications in the mobile phone industry, it is a versatile high resolution and high accuracy tool.
Four galvanometer scanner heads address the top surface while another four address equivalent areas on the bottom. Each scan field is 80 mm x 80 mm and stages which have 300 mm x 500 mm travel allow exposure of different areas of the substrate to repeat the pattern several times on the same substrate, which may then be cut into smaller pieces, one for each pattern.
Although the tool is very compact (1750mm x 1500mm) it has a vibration-isolated stable granite structure and high-accuracy stages.
- Specification
- Simultaneous processing on both sides of substrate
- Class 1 laser safe enclosure
- Various DPSS Lasers available: 1024nm, 512nm, 355nm
- Stable granite construction
- Vacuum Chuck
- 300mm x 500mm travel X-Y stages
- 8 x high speed scanner with 80mm field
- Dynamic focus control
- Dynamic focal spot size control
- Dynamic laser power control
- 1750mm x 1500mm overall footprint
Process
- UV Laser photoablation of material
- Single step, environmentally friendly, dry process
- Multiple beam scanners rapidly process both sides of board simultaneously
- 2 boards processed in parallel
- Each scan head processes up to 100 x 50mm field, suitable for hand held devices
- Step and scan operation
- Direct write, focussed spot operation
- Line-widths down to <10µm for High Density Interconnects and screened conductor runs. Larger spot sizes for pads
- Dynamic focus compensation with fast optically adjusted Z axis
- Rapid and flexible change of circuit design
