MSV308 - Direct Laser Ablation of Circuit Boards 
The MSV-308 is a high throughput manufacturing tool specifically designed for high resolution direct laser patterning of circuit boards to cut embedded conductor trenches for next generation HDI circuitry.
The tool is a fully integrated production system designed for high throughput manufacturing of HDI chip carrier and mobile phone circuit boards.
The system allows direct ablative removal of dialectric for creating fine trenches with widths down to <10um. These fine lines are filled with metal and planarised to provide embedded conductors
Included on a vibration isolated granite support structure are UV Solid State lasers and laser beam scanners for circuit formation by rapid ablation of tracks. high accurracy X-Y translation stages allow for substrate positioning and indexing.
- Specification
- High throughput
- Dual board processing
- Simultaneous dual sided and dual pattern processing
- Automated robotic board loading
- As thin as 10µm trench width
- Scan field up to 50mm x 100mm
- Dual UV 355nm lasers
- Dynamic focus compensation
- Dynamic focal spot size control
- Dynamic laser power control
- Class 1 laser safe enclosure
- Touch panel operation
- Ultra stable granite construction
- Vibration isolated machine core
Process
- UV Laser photoablation of material
- Single step, environmentally friendly, dry process
- Multiple beam scanners rapidly process both sides of board simultaneously
- 2 boards processed in parallel
- Each scan head processes up to 100 x 50mm field, suitable for hand held devices
- Step and scan operation
- Direct write, focussed spot operation
- Line-widths down to <10µm for High Density Interconnects and screened conductor runs. Larger spot sizes for pads
- Dynamic focus compensation with fast optically adjusted Z axis
- Rapid and flexible change of circuit design
