New MSV series Laser Micromachining Tools

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After an initial period incorporating early development features M-Solv proudly introduces the new MSV range of laser processing tools.

Newly designed for today's advanced manufacturing techniques the systems employ a range of Diode Pumped Solid State Lasers (DPSS) and galvanometer scanner technology which permit micron scale material removal utilising the direct write technique.  The laser beams may be manipulated in step and scan mode using both X-Y translation stages and scanner.

The range covers a spectrum of applications from smaller substrates and wafers for R&D or Silicon wafer processing to high throughput multi head production tools.   The 208 and 308 series use a proprietary design to machine both sides of a flat substrate simultaneously and with different patterns.  this not only doubles the throughput for applications that require processing on both sides but also gives accurate registration of both patterns without  the need to realign or flip the substrate.