Photoresist patterning
Laser Direct Imaging (LDI)
In addition to the ablative direct removal of material by using lasers to machine materials it is also posible to use the Ultra Violet wavelength of the laser to expose a photoresist with a specific pattern and then chemically etch away unwanted material. This traditional method can still be employed to good effect but the advantage of using a laser to directly write the lines or patterns is that the design may be changed from substrate to substrate eliminating expensive mask tooling.
Also there is a big advantage in speed and therefore manufacturing cost when the area of track to be written is very small (around 10%).
M-Solv microelectronics processing machines can be used in exactly to achieve this process which is most commonly known as LDI (Laser Direct Imaging).
