Photovoltaic Cell Manufacture
The staff of M-Solv have considerable experience of the application of laser micromachining techniques to PV Solar cell and panel manufacturing. We have the technology in-house to address appications in both wafer-based (mono-crystalline or poly-crystalline) PV processing and in thin-film PV manufacturing.
For wafer based applications our PSV-101 (x,y) platform fitted with an (x,y) galvonometer scanner, in combination with appropriate IR (1064nm), green (532nm) or blue (355nm) lasers can be configured for: edge isolation; emitter or metal wrap through (EWT, MWT) hole drilling; laser fired contacts and dopant diffusion or laser grooved buried contact (LGBC) manufacturer.
In the thin-film field M-Solv staff have experience of laser scribing for cell interconnection in a-Si (P1, P2, P3); CIS/CIGS (P1) and CdTe (P1) using IR and green lasers with various configurations of stages, gantries, etc.
