Thin Film Series Interconnection

Thin Film Series Interconnection

Amorphous Silicon - a-Si and Cadmium Telluride -

CdTe

M-Solv offer the PVP-500S series of thin film scribing tools capable of processing panels of up to "Generation 5" dimensions typically 1.1 x 1.3m. For a-Si or CdTe in "superstrate" configuration, these tools illuminate the layer to be ablated through the glass taking advantage of the efficient "explosive" laser ablation which occurs when the light beam is incident on the TCO or semiconductor in this way. Multiple, parallel, laser heads are employed to achieve rapid processing rates.

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