MSV 200

Industrial Inkjet Deposition Tool

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Applications

Process

  • Ink Jet deposition of conductive and insulating layers 
  • High accuracy printing 
  • Printing aligned to structures already present on the surface 

Capabilities/Features

  • High accuracy printing (+/- 10µm)
  • Fully digital deposition process 
  • Auto-alignment < 10µm 
  • Capable for R&D or pilot production
  • Up to 800dpi native 
  • Fully flexible process optimisation.

Laser/Optics

  • Fujifilm Dimatix Q-Class 
    • Sapphire 
    • Polaris 
    • Starfire
  • 65mm swathe  
  • Multiple print heads per system
  • eg 2x Starfire = 800dpi native 
  • Excellent jet straightness 
  • Excellent materials compatibility

Stages

Stages: *X-Y Axis (CNC)

  • Drive:  Precision linear rails + ball screw + linear encoder + servo motor
  • Travel: 610mm x 710mm
  • Speed: 250mm/s(500mm/s option available)
  • Repeatability: ±3µm
  • Accuracy: ±5µm
  • Resolution: 0.5µm

Stages: *Z Axis (CNC) Print head height control

  • Drive: Precision linear rails + ball screw + encoder + braked servo motor
  • Travel: 50mm
  • Repeatability: ±3µm
  • Accuracy: ±5µm
  • Resolution: 1µm

* Standard specification. Alternative specifications and additional axis available to suit customer requirements upon request.

Control

  • Jetting synchronised to stage encoder for high accuracy 
  • Automated ink supply 
  • Automated print head maintenance 
  • Integrated software 

Machine Architecture

  • Ultra stable granite structure        
  • Vibration isolated machine core  
  • Interlocked safety enclosure  
  • Enclosed electronics within tool footprint
  • Dimensions: 1.9m(H) x 1.6m(W) x 1.9m(D)
  • Weight: 2500kg