MSV 300

Advanced IC Package Manufacturing Tool

3 - 8

Applications

  • Organic IC Substrates
  • Wafer Level Packaging
  • Organic Interposers
  • Micro-machining

Process

  • Novel UV solid state laser process.
  • Direct ablation of organic substrate materials.
  • Direct patterning of thin films on flat substrates.
  • Direct imaging / sintering of specialist functional materials.
  • Scanned Mask Imaging (SMI) 
  • Step & repeat 
  • Scan methods: raster, point & shoot, custom path 
  • Thru’ mask via imaging (photo-mask free via processing) 

Capabilities/Features

  • High resolution imaging optics (<3µm L:S).
  • No constraints on pattern complexity.
  • Efficient debris extraction.
  • Auto-alignment <5µm, Autofocus.
  • Automatic loading (optional)
  • Fully flexible process optimisation.
  • Accurate depth control / selective material removal.

Laser/Optics

  • Wavelength:   355nm
  • Image field*:  20x20mm
  • Resolution*:  <3µm
  • Photo-mask:  up to 7x7”
  • Beam shaping optics 

Stages

Stages: *X-Y Axis (CNC)

  • Drive: Precision linear rails + linear motor + linear encoder
  • Travel: 650mm x 650mm
  • Speed: 1000mm/s
  • Repeatability: ±2µm  
  • Accuracy: ±2µm
  • Resolution: 1.0µm

Stages: *Z Axis (CNC) Focus control

  • Drive: Precision linear rails + ball screw + encoder + braked servo motor
  • Travel: 50mm
  • Repeatability: ±2µm 
  • Accuracy: ±2µm
  • Resolution: 2µm

* Standard specification. Alternative specifications and additional axis available to suit customer requirements upon request.

Control

  • Fast, high accuracy CNC X-Y translation stages
  • Mask positioner 
  • Fast galvo-scanner 
  • Dynamic autofocus 
  • Dynamic process control 
  • Efficient debris extraction 
  • M-Solv process software 
  • Auto-loading (optional) 
  • Auto-alignment (<5µm), fiducial skiving 

Machine Architecture

  • Multiple process heads (operate in parallel)
  • Ultra stable granite sub base 
  • Vibration isolated machine core 
  • Class 1 laser safe, interlocked enclosure 
  • Touch panel user interface 
  • Enclosed electronics
  • Dimensions: 2.5m(H) x 4.0m(W) x 2.3m(D)
  • Weight: 5000kg