MSV 500

Advanced Laser Processing

5 - 8

Applications

Process

  • Thin film ablation/patterning
  • Direct Write patterning
  • Step & Repeat

Capabilities/Features

  • High throughput
  • Dual panel processing
  • Simultaneous dual sided and dual pattern processing 
  • Automated robotic board loading
  • Dynamic laser power control
  • Class 1 laser safe enclosure 
  • Touch panel operation
  • Ultra stable granite construction
  • Vibration isolated machine core

Laser/Optics

  • Lasers:  wide range of DPSS and fibre lasers available for integration 
  • One or more lasers can be integrated
  • Beam conditioning options: 
  • auto or manual adjustable beam expander
  • beam shaping optics
  • Aperture imaging (multiple apertures on changer stage) 
  • Scanners: Galvanometer scan heads, up to aperture 20mm 
  • Up to 8 scanners possible 
  • Range of optics available to give laser spot sizes down to <10µm and scan areas up to  150mm x 150mm (specification depends on combination of wavelength, spot size, field size)
  • Optical Z axis

Stages

Stages: *X-Y Axis (CNC)

  • Drive: Precision linear rails + linear motor + linear encoder
  • Travel: 320mm x 650mm
  • Speed: 500mm/s
  • Repeatability: ±2µm 
  • Accuracy: ±2µm
  • Resolution: 1.0µm

Stages: **Z Axis (Manual) Focus control

  • Drive: Precision linear rails + ball screw manually adjusted and locked.
  • Travel: 200mm

* Standard specification. Alternative specifications and additional axis available to suit customer requirements upon request.

** CNC option available upon request

Control

  • Laser firing synchronised to stage or scanner movements
  • Camera + machine vision for alignment and/or inspection
  • Integrated software  

Machine Architecture

  • Ultra stable granite structure   
  • Vibration isolated machine core 
  • Class 1 laser safe, interlocked enclosure  
  • Enclosed electronics within tool footprint 
  • Dimensions: 2.0m(H) x 2.9m(W) x 2.1mm(D)
  • Weight: 6000kg