M-Solv Micro Fabrication Technology
M-Solv laser integrated micro fabrication systems currently use direct-write technology, where a focused laser beam is scanned along a pre-defined tool path. No projection mask is required; different patterns only require a new CAD file. Furthermore, our systems do not have expensive, hazardous, gases and are low maintenance maximising system availability.
M-Solv micro machining systems are driven direct from data and typically include, bitmaps, dxf and dwg formats and can be bespoke according to customer requirement. Each thin film application such as Display, Solar, High Density Interconnect Printed Wiring Boards, Microelectronics and Semiconductor processes can have specific protocols used in the manufacturing process. From research and development, pilot production to full production M-Solv integrate systems offering materials deposition, laser ablative micromachining system capable of patterning simultaneous double sided fine lines in a thin film between several microns to a few hundred microns wide.
Having an independent approach to systems integration we select the best and newest technologies the application can adopt to deliver a solution which is state of the art. In fine line ablative operations we can select the right vendor technologies in all types of beam delivery which includes fiber delivery technologies. This also applies to our material deposition technologies; we can specify the industrial ink jet head, valve or micro pump technologies which are best suited for the application.
