MSV 100

Laser Ablation R&D Tool

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Applications

  • R&D 
  • Pilot or low volume production 
  • Laser ablation for printed electronics 

Process

  • UV Laser photo-ablation of material
  • Single step, environmentally friendly, dry process
  • Rapid and flexible change of circuit design

Capabilities/Features

  • High accuracy laser processing (+/-5µm)
  • Beam conditioning optics (application specific)
  • Fully digital processing 
  • Auto-alignment < 10µm
  • Capable for R&D or pilot production
  • Fully flexible process optimisation.

Laser/Optics

  • Laser:  wide range of DPSS and fibre lasers can be integrated 
  • Beam conditioning options: 
    • auto or manual adjustable beam expander
    • beam shaping optics
  • Scanner: Galvanometer scan heads, up to aperture 20mm 
  • Range of optics available to give laser spot size down to ~ 1µm or scan area up to ~ 150mm x 150mm

 

Stages

Stages: *X-Y Axis (CNC)

  • Drive: Precision linear rails + ball screw + linear encoder + servo motor
  • Travel: 300mm x 300mm
  • Speed: 500mm/s
  • Repeatability: ±2µm
  • Accuracy: ±2µm
  • Resolution: 0.5µm

Stages: *Z Axis (CNC) Focus control

  • Drive: Precision linear rails + ball screw + encoder + braked servo motor
  • Travel: 200mm
  • Repeatability: ±3µm
  • Accuracy: 25µm
  • Resolution: 2µm

* Standard specification. Alternative specifications and additional axis available to suit customer requirements upon request.

Control

  • Laser firing synchronised to stage or scanner movements
  • Camera + machine vision for alignment and/or inspection
  • Integrated software 

Machine Architecture

        Ultra stable granite structure       
        Vibration isolated machine core 
        Class 1 laser safe, interlocked enclosure  
        Enclosed electronics within tool footprint        
        Dimensions: 1.8m(H) x 1.7m(W) x 1.05m(D)        
        Weight: 1600kg